ASMPT
| Company type | Public |
|---|---|
| Industry | Semiconductor machinery, Electronics assembly machinery |
| Founded | 1975 |
| Founder | Arthur del Prado, Patrick Lam |
| Headquarters | Singapore , Singapore |
Area served | Global |
Key people | Arthur del Prado (founder, former chairman), Patrick Lam (founder, former managing director) |
| Products | Semiconductor and electronics assembly machinery |
ASMPT (previously known as ASM Pacific Technology) is a publicly traded corporation based in Singapore, listed on the Hong Kong Stock Exchange (SEHK: 522). The company specializes in the design and manufacture of machinery for the semiconductor and electronics assembly sectors. It was originally established as the Asian division of ASM International.
History
ASMPT was established in 1975 by Arthur del Prado alongside electrical engineer Patrick Lam. The company initially operated as a sales agent for semiconductor materials and conducted limited manufacturing activities within Asia. Serving as ASM’s regional sales branch, it generated income through encapsulation equipment imported from the Netherlands and materials sourced from the United States. By 1977, ASMPT had broadened its operations to include mold base fabrication and customized trim and form tooling.
In 1979, the firm acquired a 10,000-square-foot manufacturing site dedicated to lead frame production and also took over a wire bonder manufacturing enterprise located in Hong Kong. Beginning in 1980, ASMPT concentrated on automation technologies, hiring engineering graduates to create automated machinery. This led to the release of a semi-automatic conversion kit in 1981, followed by fully automated wire bonding machines by 1984, and its inaugural die bonder designed for LED producers in 1985. By the end of the 1980s, stable profits were generated through sales of lead frames and assembly equipment.
The company inaugurated a manufacturing plant in Shenzhen in 1989 while relocating its research and development activities to Singapore to benefit from tax advantages and local engineering talent. Until its public offering on the Hong Kong Stock Exchange in January 1989, growth was primarily financed via retained earnings and bank financing. At that time, del Prado served as chairman with Lam acting as managing director.
ASMPT expanded its product range through strategic acquisitions including Siemens’ electronics assembly systems division (2011), DEK Printing Machines Ltd from Dover Corporation (2014), AMICRA Microtechnologies GmbH (2018), and Critical Manufacturing (2018). These acquisitions enhanced its capabilities in semiconductor assembly machinery and software development.
Over time, ASM International reduced its ownership from a controlling 51% stake in 1997 down to 25% by 2018 amid shareholder pressures and potential acquisition interest from entities such as TCL Technology. ASMPT considered privatization with intentions to relist on Shanghai’s STAR Market to achieve higher market valuations, maintaining support from ASM which retained its shareholding.
In February 2021, ASMPT collaborated with EV Group to advance die-to-wafer bonding technologies aimed at 3D integrated circuit applications. In August 2022, the company rebranded itself from ASM Pacific Technology to ASMPT to distinguish its corporate identity from ASM International.
Recent acquisition interest surfaced with PAG expressing intent in March 2023 and Kohlberg Kravis Roberts evaluating a potential offer as of October 2024.