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Exynos

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Samsung Exynos
Company typeProduct line
IndustrySemiconductor industry
FoundedJuly 27, 2009; 17 years ago (2009-07-27)
FounderSamsung Electronics System LSI division
Headquarters
Suwon
,
South Korea
Area served
Worldwide
ProductsArm-based system-on-chip solutions
OwnerSamsung Electronics
ParentSamsung Electronics System LSI division
Websitewww.samsung.com/semiconductor/minisite/exynos/


File:Exynos Logo.svg
Samsung Exynos logo
File:Samsung-Exynos-4412-Quad SoC used in I9300.jpg
Exynos 4 Quad (4412) mounted on the circuit board of a Samsung Galaxy S III smartphone

The Samsung Exynos (presented as SΛMSUNG Exynos),[1] initially known as Hummingbird (Template:Korean), comprises a lineup of Arm-based system-on-chip solutions engineered by Samsung Electronics' System LSI division and fabricated at Samsung Foundry. This series extends from Samsung's prior SoC families, including the S3C, S5L, and S5P product lines.

Samsung's first native SoC, the Hummingbird (S5PC110/111), later rebranded as Exynos 3 Single 3110, was unveiled on July 27, 2009. The company introduced the Exynos 4 Dual 4210 in 2011, which powered the Samsung Galaxy S II. Since then, "Exynos" has become Samsung's flagship brand for their Arm Cortex-based SoCs. In 2017, Samsung debuted its own Arm ISA-based custom CPU cores under the codename "Exynos M". The inaugural model, Exynos M1 "Mongoose," featured in the Exynos 8 Octa 8890 chipset. The Exynos M series continued to be integrated into Samsung's premium Exynos 9 series devices up to the Exynos 990. Starting in 2021, Samsung discontinued development of the M6 and M7 microarchitectures and shifted focus to Arm Cortex-X cores as the primary CPU cores.[2]

In 2022, Samsung incorporated AMD’s RDNA GPU architecture into their SoCs for the first time with the launch of the Exynos 2200 featuring the Xclipse 920 GPU, which is a customized mobile variant based on RDNA 2. By 2024, AMD RDNA 3-based GPUs were extended to midrange processors starting with the Exynos 1480 (Xclipse 530).

History

2010–2016: Pre-Mongoose Period

The year 2010 marked the release of Samsung’s Hummingbird S5PC110 (later named Exynos 3 Single) within its Galaxy S device. This SoC was built around a licensed Arm Cortex-A8 CPU.[3] The Cortex-A8 core was codenamed Hummingbird and developed collaboratively with Intrinsity using their FastCore and Fast14 technologies.[4]

Early in 2011, Samsung introduced the Exynos 4210 SoC powering the Samsung Galaxy S II smartphone. Its driver code was integrated into the Linux kernel, with support added in kernel version 3.2 released in November that year.[5][6][7]

On September 29, 2011, Samsung revealed the Exynos 4212 as an upgraded successor to the earlier model; this chip offered increased clock speeds and delivered approximately fifty percent improvement in three-dimensional graphics performance compared to its predecessor.[8] Manufactured using a 32 nm high-k metal gate low-power fabrication process, it boasted roughly thirty percent lower power consumption relative to previous generation chips.

On November 30, 2011, details emerged about an upcoming dual-core SoC featuring ARM Cortex-A15 MPCore CPUs initially branded as "Exynos 5250," later renamed Exynos 5 Dual. This chip supported a memory bandwidth of up to 12.8 GB/s and included USB 3.0 and SATA 3 interfaces. It was capable of decoding full HD video at a smooth rate of sixty frames per second while simultaneously driving WQXGA resolution (2560 ×1600) displays on mobile devices plus outputting full HD over HDMI.[9] This processor was utilized in select Chromebook models released in 2013 and served as part of a prototype supercomputer system demonstrated in 2015,[10] although final production systems opted for server-targeted chips from other manufacturers.

April 26, 2012 saw Samsung announce the Exynos 4 Quad processor powering devices such as the Samsung Galaxy S III and Samsung Galaxy Note II.[11] This quad-core SoC consumed approximately twenty percent less power than its predecessor found in Galaxy S II devices. Additionally, Samsung rebranded several SoCs during this period: Exynos 3110 became Exynos 3 Single; both Exynos 4210 and 4212 were renamed as variants of Exynos 4 Dual built on different process nodes; similarly, Exynos 5250 was renamed as Exynos 5 Dual.

In 2010, Samsung established an R&D facility in Austin, Texas — known as Samsung's Austin R&D Center (SARC). This center recruited numerous industry experts formerly associated with AMD, Intel, ARM, among others.[12] The team focuses on designing high-efficiency CPUs along with complex system IP components such as coherent interconnects and memory controllers.[13] In addition to CPU development, Samsung initiated work on proprietary GPU intellectual property called "S-GPU" starting in 2012.[14]

2016–2020: Mongoose Period

Following a development phase lasting three years, SARC introduced its inaugural custom CPU core, the M1, which debuted in the Exynos 8890 in 2016. In 2017, the San Jose Advanced Computing Lab (ACL) was established to advance custom GPU intellectual property development. That same year, Samsung unveiled the Exynos M2, an incremental update to the Exynos M1.

At Hot Chips 2018, Samsung presented the Exynos M3, codenamed Meerkat, featuring a decoder width expansion from 4-wide to 6-wide and the addition of an L3 cache architecture. This core achieved an IPC improvement exceeding 50% compared to both Exynos M1 and M2. Benchmarking with SPEC2006 demonstrated that the Exynos M3 outperformed Snapdragon 845’s Cortex-A75 at their respective maximum clock speeds, and when downclocked to 1.79 GHz, it matched the power efficiency of the Cortex-A75 in Snapdragon 845. Nonetheless, early reviews of the Samsung Galaxy S9 powered by Exynos 9810 criticized its CPU core scheduler configuration.

In 2019, Samsung introduced the Exynos 9820 featuring its fourth-generation custom core, Exynos M4 (Cheetah), fabricated using Samsung’s 8nm LPP process. Diverging from previous flagship designs with a 4+4 dual-cluster setup, the Exynos 9820 adopted a tri-cluster layout of 2+2+4 cores. Performance benchmarks indicated parity with Snapdragon 855 but revealed inferior energy efficiency. Subsequently, Samsung launched the Exynos 9825, a refined SoC produced on their initial 7nm process dubbed 7LPE. The Exynos 9825 powered devices such as the Samsung Galaxy Note10 series and Samsung Galaxy F62/M62.

The final Mongoose-based SoC arrived in 2020 as the Exynos 990, incorporating the fifth-generation custom core known as Exynos M5 or Lion. However, this iteration exhibited diminished performance and reduced power efficiency relative to Snapdragon 865’s Cortex-A77.

On October 1, 2019, reports surfaced regarding layoffs of Samsung’s custom CPU core engineering teams at SARC. A month later, on November 1, Samsung submitted a WARN notification to the Texas Workforce Commission signaling impending layoffs of SARC’s CPU group and cessation of custom CPU core development efforts. Despite this shift, SARC and ACL continued their work on custom SoCs, artificial intelligence technologies, and GPU advancements.

2021–present: Cortex and RDNA Period

On June 3, 2019, AMD and Samsung revealed a long-term strategic collaboration focused on mobile graphics IP utilizing AMD Radeon GPU technology.[15][14] According to NotebookCheck, Samsung aimed to introduce their initial SoC featuring AMD Radeon GPU IP by 2021.[16] Conversely, AnandTech indicated a 2022 timeline.[17] During AMD’s Q2 2019 earnings briefing in August, the company confirmed Samsung’s intention to launch SoCs incorporating AMD graphics IP within approximately two years.[18] The debut SoC equipped with Radeon GPU technology was the Exynos 2200, unveiled in January 2022, which includes a custom Xclipse 920 GPU based on AMD's RDNA 2 architecture.[19]

In June 2021, Samsung expanded its custom architecture efforts by recruiting engineers from both AMD and Apple to establish a dedicated team.[20]

October 2021 saw Google introduce its Pixel 6 lineup powered by the Google Tensor SoC, developed in partnership with Samsung.[21]

By 2024, Samsung formally announced the Exynos 2400 processor featuring the Xclipse 940 GPU built on RDNA 3 microarchitecture.[22] Alongside this launch, Samsung also released the Exynos 1480 with the RDNA 3-based Xclipse 530 GPU, signaling the conclusion of Arm Mali GPU usage in their mid-tier chipsets.[23]

Exynos SoCs from 2020 Onwards

Beginning in 2020, Samsung launched a new lineup of Exynos SoCs characterized by lower model numbers compared to previous generations. This change marks a clear distinction from earlier Exynos chipsets, at least in terms of their naming conventions.

Exynos 800 Series

SoC CPU GPU Memory technology NPU Modem Connectivity Launch Date Devices featuring
Model number Fabrication process Die dimensions (mm2) ISA μarch μarch Clock Speed (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 850 (S5E3830) 8 nm (Samsung 8LPP) ARMv8.2-A 8 cores Cortex-A55 at 2.0 GHz Mali-G52 MP1 1001 32 LPDDR4X Dual-channel 32-bit (2×16-bit) 1866 MHz (14.9 GB/s) —
List
  • Shannon 318 LTE Cat.7 2CA 300 Mbit/s (DL) / Cat.13 2CA 150 Mbit/s (UL)
Bluetooth 5.0, Wi-Fi 5 Q2 2020
List
Exynos 880 (S5E8805) CPU configuration: 2 high-performance Cortex-A77 cores at 2.0 GHz plus 6 Cortex-A55 cores at 1.8 GHz Mali-G76 MP5 546 131 Memory frequency: 2133 MHz (17.1 GB/s) Integrated NPU
List
  • Shannon 5G modem: LTE DL: Cat.16, up to 1000 Mbit/s, 5CA, 256-QAM UL: Cat.18, up to 200 Mbit/s, 2CA, 256-QAM 5G NR Sub-6 GHz: DL: up to 2.55 Gbit/s UL: up to 1.28 Gbit/s
List
    • Vivo Y51s
    • Vivo Y70s
    • Vivo Y70t

Exynos 900 Series

SoC CPU GPU Memory technology NPU Modem Connectivity Launch Date Devices featuring
Model number Fabrication process Die size (mm2) ISA μarch μarch Clock Speed (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 980 (S5E9630) 8 nm (Samsung 8LPP) ARMv8.2-A CPU setup: 2 Cortex-A77 cores at 2.2 GHz along with 6 Cortex-A55 cores at 1.8 GHz Mali-G76 MP5 GPU 728 174.7 LPDDR4X Dual-channel, 32-bit (2×16-bit) Memory clocked at 2133 MHz with bandwidth of 17.1 GB/s Single-core NPU combined with DSP
List
  • Shannon 5188 modem supporting: LTE DL: Cat.16 with up to 1000 Mbit/s, utilizing 5CA and 256-QAM UL: Cat.18 with up to 200 Mbit/s, using 2CA and 256-QAM 5G NR Sub-6 GHz: DL speeds up to 2.55 Gbit/s, UL speeds up to1.28 Gbit/s
Bluetooth version 5.0, Wi-Fi standards a/b/g/n/ac/ax supported Q4 of 2019
List
    • Vivo X30 Pro
    • Vivo X30
    • Vivo S6 5G
    • Samsung Galaxy A51 in its 5G variant
    • Samsung Galaxy A71 with 5G connectivity
Exynos 990 (S5E9830) Manufactured on a 7 nm process using Samsung's 7LPP technology Die measures approximately 91.83 mm2 Tri-cluster CPU configuration: two Exynos M5 "Lion" cores at up to around3.02 GHz, two Cortex-A76 cores at up to about2.6 GHz, and four Cortex-A55 cores running near2.11 GHz
Includes a system cache of size approximately two megabytes 		Mali-G77 MP11 graphics processor Achieves performance of approximately832 GFLOPS Supports LPDDR5 memory Quad-channel memory interface with a width of64 bits (4×16-bit) Memory frequency up to2750 MHz delivering bandwidth of44 GB/s Features a dual-core NPU alongside DSP capabilities
List
  • Paired with the Exynos Modem5123: LTE Downlink supports Cat.24 with speeds up to3000 Mbit/s, using eight carrier aggregation and1024-QAM modulation Uplink supports Cat.22 with speeds reaching422 Mbit/s and uses two carrier aggregation and256-QAM Supports both Sub-6 GHz and mmWave variants of the fifth-generation NR standard: Sub-6 GHz downlink reaches speeds of approximately5.1 Gbit/s mmWave downlink achieves around7.35 Gbit/s Uplink speeds remain unspecified
Released in Q1 of2020
List
    • Samsung Galaxy S20 series including S20, S20+, and S20 Ultra
    • Samsung Galaxy Note20 and Note20 Ultra models

Exynos 1000 series

SoC CPU GPU Memory technology NPU Modem Connectivity Launch date Devices equipped with
Model identifier Fabrication Die dimension (mm2) ISA μarch μarch Clock speed (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
Exynos 1080 (S5E9815) 5 nm (Samsung 5LPE) ARMv8.2-A 1 + 3 + 4 cores (2.8 GHz Cortex-A78 + 2.6 GHz Cortex-A78 + 2.0 GHz Cortex-A55) Mali-G78 MP10 800 512 LPDDR4X
LPDDR5 		64-bit (4×16-bit) Quad-channel 2133 MHz (34.1 GB/s)

2750 MHz (44 GB/s) 		NPU + DSP
(5.7 TOPs)
List
  • Shannon 5G
    LTE DL: Cat.18 1200 Mbit/s, 6CA, 256-QAM UL: Cat.18 200 Mbit/s, 2CA, 256-QAM 5G NR Sub-6 GHz DL: 5.1 Gbit/s UL: 1.28 Gbit/s 5G NR mmWave DL: 3.67 Gbit/s UL: 3.67 Gbit/s
Bluetooth 5.2, Wi-Fi 802.11a/b/g/n/ac/ax Q4 2020
List
    • Vivo S15e
    • Vivo S16e
    • Vivo X60 (China-only model)
    • Vivo X60 Pro (China-only model)
    • Vivo X60 Edge
    • Vivo X70t
    • Vivo X70 Pro (China)
Exynos 1280 (S5E8825) 2 + 6 cores (2.4 GHz Cortex-A78 + 2.0 GHz Cortex-A55) Mali-G68 MP4 897 229.6 LPDDR4X 32-bit (2×16-bit) Dual-channel 2133 MHz (17.1 GB/s) Single-core NPU 1196 MHz
(4.3 TOPs)
List
  • Shannon 5308 5G
    LTE DL: Cat.18 1.2 Gbit/s, 6CA, 256-QAM UL: Cat.18 200 Mbit/s, 2CA, 256-QAM 5G NR Sub-6 GHz DL: 2.55 Gbit/s UL: 1.28 Gbit/s 5G NR mmWave DL: 1.84 Gbit/s UL: 0.92 Gbit/s
Bluetooth 5.2, Wi-Fi 5, GNSS Q1 2022
List
Exynos 1330 (S5E8535) Mali-G68 MP2 949 121.5 LPDDR4X
LPDDR5 		2133 MHz (17.1 GB/s)

3200 MHz (25.6 GB/s) 		Template:Unk
List
  • Shannon 5308
    5G NR Sub-6 GHz 2.55 Gbps (DL) / 1.28 Gbps (UL)
    LTE Cat.18 6CC (DL) / Cat.18 2CC (UL)
Q1 2023
List
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  • Devices utilizing
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Model ID Fabrication Die dimensions (mm2) ISA μarch μarch Clock speed (MHz) FP32 Performance GFLOPS Type Bus width (bit) Bandwidth (GB/s)
  • -
  • Exynos 2100 (S5E9840)
  • 5 nm (Samsung 5LPE)
  • 128.1
  • ARMv8.2-A
  • 1 + 3 + 4 cores (2.91 GHz Cortex-X1 + 2.81 GHz Cortex-A78 + 2.2 GHz Cortex-A55)
  • Mali-G78 MP14
  • 854
  • 765.2
  • LPDDR5
  • 64-bit (4×16-bit) Quad-channel
  • 3200 MHz (51.2 GB/s)
  • 6K MAC
    Triple NPU + DSP
    1352 MHz
    (26 TOPs)
  • List
    • Exynos Modem 5123 LTE DL: Cat.24 3000 Mbit/s, 8CA, 1024-QAM UL: Cat.18 422 Mbit/s, 4CA, 256-QAM 5G NR Sub-6 GHz DL: 5.1 Gbit/s UL: 1.92 Gbit/s 5G NR mmWave DL: 7.35 Gbit/s UL: 3.67 Gbit/s
  • Bluetooth 5.0, Wi-Fi 6
  • Q1 2021
  • List
  • -
  • Exynos 2200 (S5E9925)
  • 4 nm (Samsung 4LPE)
  • 104.7
  • ARMv9.0-A
  • 1 + 3 + 4 cores (2.95 GHz Cortex-X2 + 2.70 GHz Cortex-A710 + 2.10 GHz Cortex-A510)[24]
  • Xclipse 920 "Voyager"
    (RDNA 2 based
    384:24:24:6
    3 WGP)
  • 1306
  • 1,003
  • 8K MAC
    Dual NPU + DSP
    1066 MHz
  • List
    • Shannon 5133 LTE DL: Cat.24 3000 Mbit/s, 8CA, 1024-QAM UL: Cat.22 422 Mbit/s, 4CA, 256-QAM 5G NR Sub-6 GHz DL: 5.1 Gbit/s UL: 2.55 Gbit/s 5G NR mmWave DL: 7.35 Gbit/s UL: 3.67 Gbit/s
  • Bluetooth 5.2, Wi-Fi 6E
  • Q1 2022
  • List
  • -
  • Exynos 2400/2400e (S5E9945)
  • 4 nm (Samsung 4LPP+)
  • 137.4
  • ARMv9.2-A
  • 1 + 2 + 3 + 4 cores (3.1/3.2 GHz Cortex-X4 + 2.9 GHz Cortex-A720 + 2.6 GHz Cortex-A720 + 1.95 GHz Cortex-A520)
  • Xclipse 940 "Magellan"
    (RDNA 3 based
    768:48:32:12
    6 WGP)
  • 1095
  • 3406.8
  • LPDDR5X
  • 4266 MHz (68.2 GB/s)
  • 17K MAC NPU (2x Template:Abr + 2x Template:Abr) + DSP
    1300 MHz
  • List
    • Shannon 5153 LTE DL: Cat.24 3000 Mbit/s, 8CA, 1024-QAM UL: Cat.22 422 Mbit/s, 4CA, 256-QAM 5G NR Sub-6 GHz DL: 9.64 Gbit/s UL: 2.55 Gbit/s 5G NR mmWave DL: 12.1 Gbit/s UL: 3.67 Gbit/s
  • Bluetooth 5.3, Wi-Fi 6E
  • Q1 2024
  • List
  • -
  • Exynos 2500 (S5E9955)
  • 3 nm (Samsung 3GAP)
  • 1 + 2 + 5 + 2 cores (3.3 GHz Cortex-X925 + 2.74 GHz ARM Cortex-A725 × two cores + 1.8 GHz ARM Cortex-A520)
  • Xclipse 950 "Galileo"
    (RDNA 3 based
    1024:64:64:16
    8 WGP)
  • 999
  • 4091.9
  • "24K MAC NPU (two General NPUs and two Shallow NPUs) plus DSP
    (59 TOPs)"
  • { {Collapsible list
  • Shannon 5163 LTE DL Cat24 at up to 3000 Mbit/s with 8CA and 1024-QAM UL Cat22 at up to 422 Mbit/s with 4CA and 256-QAM 5G NR Sub-6 GHz DL up to 9.64 Gbit/s UL up to 2.55 Gbit/s 5G NR mmWave DL up to 12.1 Gbit/s UL up to 3.67 Gbit/s

    • Bluetooth 5.4, Wi-Fi 7 Q2 2025

    List

    |}

    1. ↑ "cconfig"

    Past Exynos SoCs (2010–2019)

    SoC CPU GPU Memory technology NPU Modem Connectivity Released Devices using
    Model number Fabrication process Die size
    (mm2)     		Instruction Set Architecture Microarchitecture Microarchitecture Clock speed
    (MHz)     		Performance
    (GFLOPS)     		Type Bus width (bit) Memory bandwidth (GB/s)
    Exynos 3 Single 3110
    (formerly Hummingbird S5PC110)     		45 nm (Samsung 45 nm HKMG) ARMv7 Single core 1.2 GHz Cortex-A8 PowerVR SGX540 200 3.2 LPDDR, LPDDR2 or DDR2 64-bit (2×32-bit) Dual-channel 200 MHz (3.2 GB/s) Q2 2010
    List
    Exynos 3 Quad 3470 28 nm (Samsung 28 nm HKMG) Quad-core 1.4 GHz Cortex-A7 Mali-400 MP4 450 16.2 LPDDR2 or
    LPDDR3     		400 MHz (6.4 GB/s) or
    533 MHz (8.5 GB/s)     		Q3 2014
    List
    • Devices include Samsung Galaxy S5 Mini LTE, Galaxy Light, Galaxy Tab 4 7.0 LTE
    Exynos 3 Quad 3475 Quad-core 1.3 GHz Cortex-A7 Mali-T720 600 12 LPDDR3 533 MHz (8.5 GB/s) Q3 2015
    List
      • Samsung Galaxy Amp Prime (J320AZ)
      • Samsung Galaxy Express Prime (J320A)
      • Samsung Galaxy Folder
      • Samsung Galaxy J1 (2016) LTE models only
      • Samsung Galaxy J2 (2015)
      • Samsung Galaxy J2 (2017)
      • Samsung Galaxy J3 (2016) variants: J3109, J320P, J320R4, J320W8
      • Samsung Galaxy J3 V (2016) J320V model
      • Samsung Galaxy On5 and On5 Pro (2016)
      • Samsung Galaxy XCover 3 VE (G389F)
    Exynos 4 Dual 4210 45 nm (Samsung 45 nm HKMG) Dual-core 1.4 GHz Cortex-A9 Mali-400 MP4 266 9.6 LPDDR2, DDR2 or DDR3 memory types supported 400 MHz bus speed (6.4 GB/s)[25] Q2 2011
    List

    List of Exynos Wearable SoCs

    SoC CPU GPU Memory technology NPU Modem Connectivity Released Devices using
    Model number Fab. Die size (mm2) ISA μarch μarch Frequency (MHz) Performance GFLOPS (FP32) Type Bus width (bit) Bandwidth (GB/s)
    Exynos 4 Single 4212[27][28] 32 nm (Samsung 32 nm HKMG) ARMv7-A Single core 0.8 GHz Cortex-A9 Mali-400 MP4 400[29] 14.4 LPDDR2, DDR2, or DDR3 64-bit (2×32-bit) Dual-channel 400 MHz (6.4 GB/s) rowspan=7 Template:N/A Q3 2013
    List
    Exynos 2 Dual 3250 28 nm (Samsung 28 nm HKMG) Dual core 1.0 GHz Cortex-A7 Mali-400 MP2 400 7.2 LPDDR2 or
    LPDDR3     		Q2 2014
    List
    Exynos 7 Dual 7270
    (SC57270)[30]     		14 nm (Samsung 14LPP) ARMv8-A Dual core 1.0 GHz Cortex-A53 Mali-T720 MP1 667 13.3 LPDDR3 32-bit (2×16-bit) Dual-channel Template:Unk LTE Cat.4 with 2CA at 150 Mbit/s downlink and 50 Mbit/s uplink Bluetooth 4.2, Wi-Fi 4, GPS, GLONASS, BeiDou, Galileo, eMMC Q3 2016

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    List of Exynos Modems

    Exynos Modem 303

    • Compatibility: LTE FDD, LTE TDD, WCDMA, GSM/EDGE
    • LTE Category: 6
    • Downlink Speed: 2CA 300 Mbit/s with 64-QAM
    • Uplink Speed: 100 Mbit/s using 16-QAM
    • Manufacturing Process: 28 nm HKMG
    • Integrated with: Exynos 5 Octa 5430 and Exynos 7 Octa 5433
    • Featured in Devices: Samsung Galaxy Note 4, Samsung Galaxy Note Edge, Samsung Galaxy Alpha

    Exynos Modem 333

    • Supported Technologies: LTE FDD, LTE TDD, WCDMA, TD-SCDMA, GSM/EDGE
    • LTE Category: 10
    • Downlink Capability: 3CA 450 Mbit/s with 64-QAM
    • Uplink Capability: 2CA 100 Mbit/s using 16-QAM
    • Fabrication Technology: 28 nm HKMG
    • Coupled with: Exynos 7 Octa 7420
    • Used in Models: Samsung Galaxy S6, Samsung Galaxy Note 5, Samsung Galaxy A8 (2016)

    Exynos Modem 5100

    • Supported Networks: 5G NR Sub-6 GHz, 5G NR mmWave, LTE-FDD, LTE-TDD, HSPA, TD-SCDMA, WCDMA, CDMA, GSM/EDGE
    • Downlink Features:
      • Up to 8CA in 5G NR
      • LTE Cat.19 with 8CA delivering 1.6 Gbit/s
      • 4x4 MIMO antenna configuration
      • FD-MIMO support
      • Maximum modulation of 256-QAM in sub-6 GHz reaching up to 2 Gbit/s
      • Up to 64-QAM in mmWave achieving speeds of up to 6 Gbit/s
    • Uplink Features:
      • Supports 2CA in both 5G NR and LTE
      • Up to 256-QAM modulation for sub-6 GHz signals
      • Up to 64-QAM for mmWave frequencies
    • Process Node: 10 nm FinFET
    • Integrated with: Exynos 9820 and Exynos 9825 chipsets
    • Devices Featuring This Modem: Samsung Galaxy S10 and Samsung Galaxy Note 10

    Exynos Modem 5123

    • Supported Standards: 5G NR Sub-6 GHz, mmWave, LTE-FDD, LTE-TDD, HSPA, TD-SCDMA, WCDMA, CDMA, GSM/EDGE
    • Downlink Specifications:
      • LTE Cat.24 with 8CA and 1024-QAM delivering up to 3.0 Gbit/s
      • Sub-6 GHz with up to 256-QAM supporting speeds of up to 5.1 Gbit/s
      • mmWave up to 64-QAM offering maximum throughput of approximately 7.35 Gbit/s
    • Uplink Specifications:
      • LTE Cat.22 with 2CA and up to 256-QAM at speeds reaching around 422 Mbit/s
      • Sub-6 GHz supporting up to 256-QAM
      • mmWave up to 64-QAM modulation
    • Manufacturing Process: Advanced 7 nm FinFET
    • Paired With Processors: Exynos 990, Exynos 2100, Google Tensor
    • Deployed In Devices Such As: Samsung Galaxy S20, Samsung Galaxy Note 20, Samsung Galaxy S21, Google Pixel 6

    Exynos Modem 5300

    • Network Support: 3GPP Release 16 compliant for 5G NR Sub-6 GHz & mmWave (both SA and NSA), LTE-FDD, LTE-TDD, HSPA, TD-SCDMA, WCDMA, CDMA, GSM/EDGE
    • Downlink Capabilities (Up to 10 Gbit/s):
      • For Sub-6 GHz:
        • Supports up to 256-QAM
        • Employs a 4x4 MIMO antenna array
        • Carrier aggregation bandwidth of up to 200 MHz
      • For mmWave:
        • Supports modulation up to 64-QAM
        • Utilizes a 2x2 MIMO configuration
        • Carrier aggregation bandwidth reaching up to 800 MHz
    • Uplink Capabilities (Up to 3.9 Gbit/s):
      • Sub-6 GHz:
        • Up to256-QAM modulation support
        • Uses a2x2 MIMO setup
        • Carrier aggregation bandwidth of400 MHz
      • mmWave:
        • Supports up to64-QAM modulation
        • Incorporates a2x2 MIMO antenna system
        • Carrier aggregation bandwidth of800 MHz
    • Fabrication Technology: Cutting-edge4 nm EUV
    • Integrated With Chipsets: Exynos2200, Google Tensor G2, Google Tensor G3
    • Featured In Devices Like: Samsung Galaxy S22, Google Pixel7, Google Pixel8

    Exynos Modem 5400

    • Supported Networks and Modes: Compliant with 3GPP Release17 standards for 5G NR Sub-6 GHz & mmWave (SA/NSA/NTN), LTE-FDD/TDD, HSPA, WCDMA, GSM/EDGE including NB-IoT NTN support
    • Downlink Performance:
      • For5G FR1:
        • Maximum speed of11.2 Gbit/s
        • Supports1024-QAM
        • Employs4x4 MIMO antenna arrays
        • Aggregates carriers across380 MHz (5CA consisting of three100 MHz and two40 MHz bands)
      • For5G FR2:
        • Peak throughput of14.8 Gbit/s
        • Up to256-QAM modulation
        • Uses2x2 MIMO configuration
        • Carrier aggregation bandwidth of1000 MHz
    • Uplink Performance (Up to3.9 Gbit/s):
      • For5G FR1:
        • Supports256-QAM
        • Utilizes2x2 MIMO antennas
        • Aggregates carriers across400 MHz
      • For5G FR2:
        • Maximum modulation of64-QAM
        • Employs2x2 MIMO setup
        • Carrier aggregation bandwidth reaching800 MHz
    • Manufacturing Process: Advanced4 nm EUV lithography
    • Paired With Processors Such As: Exynos2400 and Google Tensor G4
    • Incorporated In Devices Including: Samsung Galaxy S24 and Google Pixel9

    Exynos IoT SoC Lineup

    Exynos i T200

    • Processor: Cortex-M4 and Cortex-M0+ cores, each running at 320 MHz
    • Wireless: Single-band WiFi 802.11b/g/n operating at 2.4 GHz
    • Embedded Memory: 1.4 MB SRAM
    • Connectivity Interfaces: SDIO, I2C, SPI, UART, PWM, I2S
    • RF Front-end: Integrated transmit/receive switch, Power Amplifier, Low Noise Amplifier
    • Security Features: Support for WEP 64/128, WPA, WPA2, AES, TKIP, WAPI encryption protocols and PUF (Physically Unclonable Function)

    Exynos i S111

    • Processor: Cortex-M7 at 200 MHz
    • Modem: LTE Release 14 NB-IoT technology
      • Downlink speed: up to 127 kbit/s
      • Uplink speed: up to 158 kbit/s
    • On-chip Memory: 512 KB SRAM
    • Interfaces: USI, UART, I2C, GPIO, eSIM interface, SDIO (Host), QSPI (Single/Dual/Quad IO modes), SMC
    • Security Components: eFuse, AES encryption, SHA-2 hashing, PKA, Secure Storage solution, Security Sub-System, and PUF
    • GNSS Support: GPS, Galileo, GLONASS, BeiDou satellite systems

    Exynos Auto Series

    SoC Model CPU Architecture GPU Details Memory Specifications NPU Modem Capabilities Connectivity Options Launch Date Target Vehicles
    Model Number Fabrication Process Die Size
    (mm2)     		Microarchitecture Clock Speed (MHz) GFLOPS Performance
    (FP32)     		GPU Type Bus Width
    (bit)     		Memory Bandwidth
    (GB/s)
    Exynos Auto 8890 (SGA8890A) 14 nm
    (Samsung 14LPP)     		Octa-core
    (4 cores at 2.6 GHz[32] Exynos M1 "Mongoose" + 4 Cortex-A53 cores at 1.6 GHz)
    (ARMv8-A)     		Mali-T880 MP12 650 GFLOPS 327.6 MHz LPDDR4 RAM Dual-channel 64-bit (2×32-bit) N/A Shannon LTE
    DL: LTE Cat 12 at 600 Mbit/s with 3CA
    UL: LTE Cat 13 at 150 Mbit/s with 2CA     		Bluetooth 4.2 and Wi-Fi 5 support Q1 2017 Audi A4 (B9) model years 2019–2025
    Exynos Auto T5123 7 nm
    (Samsung 7LPP)     		Dual-core ARM Cortex-A55
    (ARMv8.2-A)     		LPDDR4X memory Single-channel 16-bit (1×16-bit) Bandwidth of 8.5 GB/s at 2133 MHz LTE DL Cat.24 at 3000 Mbit/s with 8CA and 1024-QAM
    UL Cat.22 at 422 Mbit/s with 2CA and 256-QAM
    5G NR Sub-6 GHz DL at 4.55 Gbit/s UL at 1.92 Gbps     		Q4 2021
    Exynos Auto V7 8 nm
    (Samsung 8LPP)     		Octa-core with eight ARM Cortex-A76 cores at 1.5 GHz
    (ARMv8.2-A)     		Dual Mali-G76 GPUs (MP8 + MP3) LPDDR4X and LPDDR5 support 128-bit bus (Octa-channel: 8×16-bit) Memory clocked at 2133 MHz for a bandwidth of approximately 68.2 GB/s Integrated NPU included Q4 2021
    Exynos Auto V9 (S5AHR80A) Eight cores with ARM Cortex-A76 running at up to 2.1 GHz
    (ARMv8.2-A)     		Triple Mali-G76 GPUs configured as MP12 + MP3 + MP3

    NPU delivering performance of about 8.5 TOPS (Tera Operations Per Second)

    		Bluetooth version 5.0 and Wi-Fi 6 connectivity options available Q1 2019
    Exynos Auto V920 (S5AV920) 5 nm
    (Samsung 5LPE)     		Ten-core setup (4+4+2 configuration) featuring ARM Cortex-A78AE cores
    (ARMv8.2-A)     		Samsung Xclipse GPU architecture employed

    LPDDR5 memory type supported

    		Octa-channel with a total bus width of 128-bit (8×16-bit) Operating frequency of memory is up to 3200 MHz providing bandwidth of approximately102.4 GB/s Advanced NPU delivering up to around23.1 TOPS processing power Scheduled release in the year2025

    The Exynos Auto V9 offers additional capabilities including:

    • Compliance with Automotive Safety Integrity Level (ASIL)-B requirements
    • Dedicated safety island processor core
    • Four Tensilica HiFi 4 Digital Signal Processors for audio and voice applications
    • Ability to handle up to six displays alongside support for twelve camera inputs configured as three groups of four lanes each via MIPI CSI
    • Video encoding and decoding capabilities supporting resolutions up to4096×4096 pixels at120 frames per second using HEVC(H.265) codec
    • Dual Gigabit Ethernet ports

    The Exynos Auto V920 features enhancements such as:

    • Three Tensilica HiFi 5 Digital Signal Processors for advanced audio processing
    • Support for six displays including three with resolutions of up to5K (8K×2K) and three DFHD panels (3840×1440), plus twelve camera inputs consisting of three MIPI CSI interfaces each with four lanes
    • High-performance video decoding at4K resolution and240 frames per second using HEVC format as well as encoding capabilities at4K and120 frames per second
    • Two USXGMII Ethernet interfaces capable of10 Gbps speeds

    Controversies

    Between 2019 and 2021, several Samsung smartphones equipped with the Exynos 9611 chipset experienced widespread reports from users regarding unexpected restarts, system freezes, and boot-loop issues. Affected models included the Galaxy A50, A50s, A51, M30s, M21, M31, M31s, F41, and the 2021 edition of the Galaxy M21. While mainstream media coverage was minimal and only a handful of YouTube reviewers addressed these problems based on user feedback, extensive documentation of the faults appeared on the official Samsung Members community forums. Additionally, discussions proliferated on Reddit and various other online platforms.

    The volume of user complaints was considerable, spanning hundreds of posts and comments from 2020 through 2023. In response, Samsung provided complimentary motherboard replacements for some customers whose devices were still under warranty. However, most users encountered these malfunctions after the standard 12-month warranty had expired, typically manifesting between 18 months to three years post-purchase. Despite the severity and persistence of the issue, Samsung never publicly admitted to the defect nor issued any software updates aimed at resolving it, although security updates continued as promised for a minimum of four years.

    The sole official remedy offered involved purchasing a replacement motherboard at a cost amounting to approximately 60 to 70 percent of the phone’s original price. Consequently, many users opted for more affordable but riskier third-party repairs involving re-soldering—or reballing—the CPU and RAM Package on Package (PoP) components. Numerous reports on community forums indicated that this procedure successfully alleviated the problem for a significant number of affected devices.

    See also

    Comparable platforms

    References

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    10. ↑ Lua error in Module:Citation/CS1/Configuration at line 2123: attempt to index field '?' (a nil value).
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    24. ↑ Actual CPU clock speeds on the products are 2.80, 2.52, and 1.82 GHz, for respective cores.
    25. ↑ Lua error in Module:Citation/CS1/Configuration at line 2123: attempt to index field '?' (a nil value).
    26. ↑ Cite error: Invalid <ref> tag; no text was provided for refs named origenboard
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    29. ↑ Lua error in Module:Citation/CS1/Configuration at line 2123: attempt to index field '?' (a nil value).
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    32. ↑ Reduced to 2.3 GHz when more than two cores are active
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    External links

    Template:Application ARM-based chips Template:Samsung Electronics

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