Multibeam Corporation

Multibeam

Company type	Private
Industry	Semiconductor equipment
Founded	2010
Headquarters	Santa Clara, California , United States
Key people	Dr. David K. Lam (CEO)
Products	Semiconductor fabrication equipment, multi-column e-beam lithography (MEBL) platforms

Multibeam is a United States-based enterprise focused on the development, production, and distribution of semiconductor fabrication equipment used in integrated circuit manufacturing. Headquartered in Santa Clara, California, the company is under the leadership of Dr. David K. Lam, who previously founded and served as the inaugural CEO of Lam Research. Multibeam holds membership in the eBeam Initiative.

History

In July 2024, Multibeam completed the delivery of its initial MEBL system to SkyWater Technology located in Bloomington, Minnesota.

Technology

The company has engineered compact, fully electrostatic columns for e-beam lithography, providing a maskless, high-efficiency solution for inscribing nanoscale integrated circuit patterns across entire wafers. The simultaneous operation of multiple e-beam columns enhances wafer throughput significantly. With a portfolio exceeding 35 granted patents, Multibeam’s multi-column e-beam lithography (MEBL) platforms accommodate a range of direct-write uses including Complementary E-Beam Lithography (CEBL), Secure Chip ID, Advanced Packaging Interposers, and Photonics, facilitating nanometer-precision feature creation.

Applications

• Complementary Electron Beam Lithography (CEBL) serves as a supplement to optical lithography by enabling maskless patterning of cuts and holes, thereby improving "lines-and-cuts" design workflows.
• Secure Chip ID technology integrates distinctive security information—such as chip identification numbers, IP or MAC addresses, and encryption keys—directly into integrated circuits to support supply chain verification, counterfeit prevention, and hardware-level software authentication.
• Advanced Packaging Interposers address semiconductor packaging requirements that demand high efficiency, reduced power consumption, and miniaturization. They facilitate nanometer-scale patterning across extensive areas suitable for mass production of System in a Package (SiP), MEMS & Sensor Packaging, Fan Out Packaging, as well as 2.5D/3D IC Packaging.
• Photonics applications utilize Multibeam’s solutions to fabricate accurate curvilinear and variable geometries over broad fields for purposes including light generation, manipulation, and routing.