Flip-Chip module
| Industry | Computer hardware |
|---|---|
| Founded | 1957 |
| Headquarters | United States |
| Products | Flip-Chip modules, PDP-7, PDP-8, PDP-9, PDP-10 computer systems |
A Flip-Chip module represents a digital logic unit created by Digital Equipment Corporation (DEC) for use in its PDP-7, PDP-8, PDP-9, and PDP-10 computer systems and associated peripheral devices, first launched on August 24, 1964.
Description
Within DEC, this term described a unique packaging technique for electronic circuits applied in central processing units, peripheral interface controllers, and various digital or analog equipment. The earliest flip-chip modules featured single-sided 18-pin card edge connectors spaced at intervals of 1/8 inch. These circuit boards measured 2-7/16 inches in width and 5 inches in length, with an additional half-inch for the handle; double-height modules incorporated two connectors placed side by side, resulting in a width of 5-3/16 inches. Subsequent versions utilized double-sided boards equipped with compatible 36-pin edge connectors on both sides without altering the external size. To accommodate more circuitry, "standard-length" modules were complemented by longer "extended-length" variants.
As circuit boards grew larger, DEC introduced extended-length quad-height (four connectors) and hex-height (six connectors) modules. These expanded boards frequently included metal levers designed to assist with insertion and removal forces from backplane connectors. Modules were inserted into backplanes made up of connector blocks linked via wirewrap technology—a transition from earlier hand-wired and soldered backplanes that addressed manufacturing difficulties. Diagnostic efforts concentrated on the module level, enabling rapid replacement of faulty units to sustain operational continuity.
Color-coded plastic handles served to distinguish different circuit design families, reflecting differences in power supply voltages, logic signal levels, and switching speeds.
History
The Flip Chip name was officially trademarked on August 27, 1964. DEC documentation variably references these modules as "FLIP CHIP", "FLIP-CHIP", "Flip Chip", and "Flip-Chip," often accompanied by trademark indicators.
Certain modules, such as the R107, incorporated hybrid integrated circuit technology where discrete diode chips were affixed onto ceramic substrates. Some flip-chip boards were engineered to permit substitution with discrete components. The early adoption of hybrid integrated circuits facilitated DEC’s promotion of the PDP-8 as an integrated circuit computer.
Although DEC later shifted to using monolithic integrated circuits, they retained the "Flip-Chip" designation for their circuit board modules despite no longer employing true flip chip mounting methods. The "Flip-Chip" trademark remained under DEC’s ownership until its expiration on June 6, 1987.